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分别在普通和真空热处理炉中对Cu/Ni镶嵌式扩散偶进行退火热处理,利用扫描电子显微镜和电子探针显微分析仪观察和分析了扩散溶解层的形态和结构,并对其形成机理进行了探讨。结果表明,Cu/Ni扩散偶在950℃、100h退火处理时,Cu/Ni扩散溶解层主要在Ni块上形成,形状依附于原始界面,并逐渐向Ni块基体延伸,与Ni块没有界面,其结构是以Ni为溶剂、Cu为溶质的间隙固溶体;扩散溶解层的形成机理是Cu原子向Ni块扩散,Ni原子几乎不向Cu丝扩散,Cu丝溶解在Ni块里面。
The Cu / Ni mosaic diffusion couples were annealed and annealed respectively in ordinary and vacuum heat treatment furnaces. The morphologies and structures of the diffusion-dissolved layers were observed and analyzed by scanning electron microscopy and electron probe microanalyzer. The formation mechanism was also studied Exploring. The results show that the Cu / Ni diffusion bonding layer is mainly formed on the Ni block when annealed at 950 ℃ for 100h. The shape of the Cu / Ni diffusion bonding layer depends on the original interface and gradually extends to the Ni block matrix without interface with the Ni block. The structure is Ni-based solute and Cu is interstitial solid solution. The formation mechanism of diffusion-dissolved layer is that Cu atom diffuses to Ni block, Ni atom hardly diffuses to Cu wire, and Cu wire dissolves in Ni block.