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研究金刚石砂轮磨削单晶硅片时的表面磨削温度 .针对平形砂轮和杯形砂轮两种不同平面磨削方式所产生的表面磨削温度特点进行了比较分析 .对砂轮粒度和磨削深度对这两种平面磨削方式的表面磨削温度的影响进行了试验研究 ,得到了一些有意义的试验结果和结论
This paper studies the surface grinding temperature of diamond grinding wheel when grinding monocrystalline silicon wafer.The characteristics of surface grinding temperature produced by two different planar grinding methods of flat grinding wheel and cup grinding wheel are compared and analyzed.The effects of grinding wheel granularity and grinding depth The effects of these two surface grinding methods on the surface grinding temperature were studied experimentally and some meaningful results and conclusions were obtained