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采用光敏BCB介质工艺制作了In P基TRL校准件和无源器件,研究了这种毫米波片上集成技术。光敏BCB工艺包括三层金属和一层BCB介质。为了验证工艺可行性,采用电磁仿真器设计了TRL校准件和两种无源电路。使用TRL去嵌技术,得到两种无源电路在75~110 GHz内的本征特性。通过比较去嵌后本征特性和仿真结果,发现与仿真结果相比S11/S22的幅度波动小于5 d B,S12/S21的幅度波动小于0.3 d B。仿真结果与去嵌后的本征结果重合度比较好,这进一步说明光学BCB工艺比较适合毫米波校准件的研制。
InP-based TRL calibrators and passive devices were fabricated using photosensitive BCB dielectric technology. The integration technology on the millimeter wave was studied. The photosensitive BCB process includes three layers of metal and a layer of BCB media. To verify the feasibility of the process, a TRL calibration and two passive circuits were designed using an electromagnetic simulator. Using TRL de-embedding technique, the intrinsic characteristics of the two passive circuits in 75 ~ 110 GHz are obtained. By comparing the de-embedding eigenfunctions and simulation results, it is found that the amplitude of S11 / S22 fluctuates less than 5 d B compared to the simulation results, and the amplitude of S12 / S21 fluctuates less than 0.3 dB. The coincidence of the simulation results with the intrinsic results of de-embedding is better, which further shows that the optical BCB process is more suitable for the development of millimeter-wave calibration parts.