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混合集成电路(HIC)是半导体集成电路外围元件的二次集成。作为微电子领域的一个重要分支,HIC 几乎是与半导体集成电路产业同步发展起来的,HIC的发展首先得益于军事电子装备的高性能、多功能、小型化、高可靠的要求,继之受到计算机等消费类电子工业的发展而牵引。到20世纪80代后期,HIC日渐成熟,迅速向消费类行业、通讯行业、汽车行业等渗透,应用领域逐渐扩大,产品种类和产量不断增加。并且HIC正在发展之中,可以充分利用混合的技术优势,能够在设计上、工艺上、产品结构上、热电指标上,尽可能多地产生许多新的发展趋势,为扩大HIC的应用领域,找到更多用途。例如先进的MCM(多芯片组件)在
Hybrid integrated circuits (HICs) are secondarily integrated peripheral components of semiconductor integrated circuits. As an important branch of the microelectronics field, HIC develops almost simultaneously with the semiconductor integrated circuit industry. The development of HIC firstly benefits from the high performance, multi-functional, miniaturization and high reliability requirements of military electronic equipment. Computer and other consumer electronics industry and traction. By the late 80s of the 20th century, HIC matured rapidly and infiltrated into the consumer, communications and automotive industries rapidly. Its application fields were gradually expanding, and its product range and output were constantly increasing. And HIC is under development and can make full use of the advantages of hybrid technology. It can create as many new trends as possible in terms of design, technology, product structure, and thermoelectric indicators. In order to expand the application fields of HIC, More uses. For example, advanced MCM (multi-chip components) in