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采用OM、XRD、导电率和硬度测试等分析方法研究了固溶时效工艺对Cu-4Ni-2Sn-Si合金的显微组织及性能的影响。结果表明,热轧态Cu-4Ni-2Sn-Si合金中未溶解的第二相Ni2Si颗粒随着固溶温度的升高逐渐回溶,且发生再结晶,再结晶晶粒逐渐长大。当温度升高至900℃时,第二相粒子基本回溶到合金基体中。经时效处理后,合金的硬度受到析出相与再结晶的交互作用的影响。当时效温度低于450℃时,硬度值随时效时间的延长呈现先增大后减小的趋势;而时效温度升高至500℃时,合金硬度值随时效时间的延长而逐渐下降。而导电率则随时效时间的延长一直保持增大的趋势。热轧态Cu-4Ni-2Sn-Si合金经900℃×1 h固溶处理+68%冷轧变形+450℃×6 h时效处理后获得较优的综合性能,其硬度值为225 HB,导电率为24.5%IACS。
The effects of solution aging treatment on the microstructure and properties of Cu-4Ni-2Sn-Si alloy were investigated by OM, XRD, conductivity and hardness test. The results show that the second phase Ni2Si, which is undissolved in hot-rolled Cu-4Ni-2Sn-Si alloy, gradually returns to solution with the increase of solution temperature and recrystallizes and the recrystallized grains grow up gradually. When the temperature is raised to 900 ° C, the second phase particles are substantially dissolved back into the alloy matrix. After aging treatment, the hardness of the alloy is affected by the interaction between precipitated phase and recrystallization. When the aging temperature is lower than 450 ℃, the hardness value increases first and then decreases with the aging time. When the aging temperature is increased to 500 ℃, the hardness value of the alloy gradually decreases with the aging time. The conductivity with the extension of the aging time has been increasing trend. After hot-rolled Cu-4Ni-2Sn-Si alloy was treated by solution treatment at 900 ℃ for 1 h and 68% cold-rolled at + 450 ℃ for 6 h, the hardness and hardness of Cu-4Ni-2Sn-Si alloy were 225 HB, The rate is 24.5% IACS.