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中国惠普公司于1996年4月23日在北京皇家大饭店召开小型记者招待会,介绍最新推出的两种新型且面向中国市场的电路板测试系统。 针对电路板的生产测试设备在现代电子制造业中已成为必不可少的组成部分。特别是在产品集成度越来越高,新的元器件封装技术不断涌现,质量要求又不断提高的今天,采用大密度元器件和多层电路板设计,经波峰焊和SMT后再经整板测试的生产模式已成为一种潮流。
China Hewlett-Packard Company held a small press conference on April 23, 1996 at the Royal Hotel in Beijing to introduce the two new types of circuit board test systems for the Chinese market. Production test equipment for circuit boards has become an integral part of modern electronics manufacturing. In particular, as product integration becomes higher and higher, new component packaging technologies continue to emerge, and quality requirements continue to improve, high-density components and multilayer circuit board designs are adopted. After wave soldering and SMT, the entire board is used. The production mode of testing has become a trend.