论文部分内容阅读
通过溶剂热法制备出六方相Bi2Te3纳米粉体,采用真空封管熔炼法得到Sb掺杂的Bi0.5Sb1.5Te3合金。采用溶剂热法合成粒度为40 nm的Ag2Te纳米粉体,并通过高能球磨工艺将其掺入Bi0.5Sb1.5Te3合金,从而得到p-(Ag2Te)x(Bi0.5Sb1.5Te3)1-x合金(x为Ag2Te摩尔分数,x=0,0.025,0.05,0.075)。采用快速热压工艺制备该合金的块体材料,在300～573 K温度范围内研究不同掺杂量对材料的热电性能的影响。研究结果表明,当x=0.075,电导率在300 K时达到900 S/cm,Seebeck系数在573 K时达到206μV/K,功率因子在300K时达到17.6μW/(cm.K2)。
The hexagonal Bi2Te3 nanopowder was prepared by solvothermal method and the Sb-doped Bi0.5Sb1.5Te3 alloy was obtained by the vacuum sealing and melting method. The Ag2Te nanopowder with a particle size of 40 nm was synthesized by solvothermal method and incorporated into the Bi0.5Sb1.5Te3 alloy by a high-energy ball milling process to obtain the p- (Ag2Te) x (Bi0.5Sb1.5Te3) 1-x alloy (x is the Ag2Te mole fraction, x = 0,0.025,0.05,0.075). The bulk material of the alloy was prepared by rapid hot pressing process, and the effects of different doping amount on the thermoelectric properties of the material were studied in the temperature range of 300 ~ 573 K. The results show that when x = 0.075, the conductivity reaches 900 S / cm at 300 K, the Seebeck coefficient reaches 206 μV / K at 573 K, and the power factor reaches 17.6 μW / (cm.K2) at 300K.