当前的封接合金,普遍存在高温下晶粒急剧长大,在深冲时另件出现桔皮状,封接时造成焊料渗透,致封接件脆裂或漏气,为解决这一质量问题,各国都竞相研究解决办法。从70年代末,由清华大学,北京电真空器件研究所、我所等单位共同合作,在原低钴瓷封合金的基 The current sealing alloy, the prevalence of rapid growth of the crystal at high temperature, the other parts appear deep orange peel shape, sealing caused by the infiltration of solder, sealing pieces caused by a rupture or leakage, in order to solve this quality problem All countries are competing to find solutions. From the late 70s, Tsinghua University, Beijing Institute of Vacuum Devices, I and other units work together in the original low-cobalt porcelain seal base