系统研究了Cu Ni合金基带和纯Ni基带的织构形成及转变规律 ,重复地获得了稳定的再结晶 { 0 0 1}<10 0 >立方织构。用表面氧化外延 (SOE)法生成了NiO(2 0 0 )薄膜。轧制总加工率、轧制道次和轧制方向对轧制织构的形成起主要作用 ;再结晶温度、时间是立方织构形成的主要影响因素。在获得了强立方织构Cu Ni合金基底上(其中Φ扫描曲线的半高宽 (FWHM)≤ 10°) ,通过SOE方法得到了取向良好NiO(2 0 0 )缓冲层 We systematically studied the texture formation and transformation of Cu Ni alloy and pure Ni matrix, and obtained the stable recrystallized {0 0 1} <10 0> cubic texture repeatedly. NiO (200) thin films were formed by surface oxidation epitaxy (SOE). The total rolling rate, rolling pass and rolling direction played a major role in the formation of rolling textures. The recrystallization temperature and time were the main influencing factors of cubic texturing. After obtaining a strong cubic textured Cu-Ni alloy substrate (FWHM of Φ-scan curve ≤ 10 °), a well-aligned NiO (200) buffer layer was obtained by SOE method