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研究微量Ni元素对Sn2.5Ag0.7Cu钎料显微组织和力学性能的影响。结果表明,Sn2.5Ag0.7Cu合金主要由β-Sn相、Ag3Sn相和Cu6Sn5相组成;添加微量的Ni元素后,可以有效地细化合金的内部组织,且共晶组织内部产生以Cu6Sn5相为基的(Cu,Ni)6Sn5相,或Ag3Sn相为基的(Ag,Ni)3Sn相。焊点界面主要为Cu基体、IMC层和钎料3个区域;随着钎焊时间的延长或钎焊温度的增加,IMC层在Cu基体侧较为光滑平坦,而钎料侧呈现扇贝状分布;钎焊接头的剪切强度都是呈先增大后减小趋势,在钎焊时间240 s和钎焊温度300℃达到最大值48 MPa。
The effects of trace Ni on the microstructure and mechanical properties of Sn2.5Ag0.7Cu solder were studied. The results show that Sn2.5Ag0.7Cu alloy is mainly composed of β-Sn phase, Ag3Sn phase and Cu6Sn5 phase. Adding a small amount of Ni element can effectively refine the internal structure of the alloy, and the eutectic structure has Cu6Sn5 phase as (Cu, Ni) 6Sn5 phase, or an (Ag, Ni) 3Sn phase based on the Ag3Sn phase. The interface of the solder joints is mainly composed of Cu matrix, IMC layer and brazing filler metal. The IMC layer is smooth and flat on the Cu matrix side and the scalloped side of the solder side with the increase of brazing time or brazing temperature. The shear strength of brazed joint first increases and then decreases, reaching the maximum of 48 MPa at brazing time 240 s and brazing temperature 300 ℃.