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以BAg50CuZn钎料为基材,采用电镀热扩散组合工艺制备了镀锡AgCuZnSn钎料。为了揭示镀锡银钎料的热力学特性,借助差示扫描量热仪(DSC)测定了镀锡银钎料的熔化温度,运用热分析动力学中的非等温微分法和积分法分析了镀锡银钎料的相变热力学特性,并利用金相显微镜和X射线衍射仪(XRD)对钎料熔化后润湿界面的显微组织和物相进行了分析。研究表明,随着Sn含量升高,在吸热峰镀锡银钎料由固态向液态转变的温度区间变窄,非等温微分法和积分法得到的钎料相变活化能均逐渐增大。在Sn含量为7.2%时,镀锡银钎料的相变活化能和指前因子最大,分别为555.56kJ/mol、1.41×10~(32),此时镀锡银钎料相变速率方程的表达式为:k=1.41×10~(32)exp(-5.56×10~5/RT)。7.2%Sn含量的镀锡银钎料在304不锈钢表面熔化后,润湿界面组织主要由Ag相、Cu相、CuZn相、Cu_5Zn_8相、Cu_(41)Sn_(11)相、Ag_3Sn相组成。
With BAg50CuZn solder as substrate, a tin-plated AgCuZnSn solder was prepared by electroplating thermal diffusion combined process. In order to reveal the thermodynamic properties of tin-plated silver solder, the melting temperature of tin-plated silver solder was measured by means of differential scanning calorimeter (DSC). The non-isothermal differential method and integral method of thermal analysis kinetics were used to analyze the tin- Silver solder phase transition thermodynamic properties, and the use of metallographic microscope and X-ray diffraction (XRD) analysis of the solder after melting the wetting interface microstructure and phase were analyzed. The results show that with the increase of Sn content, the temperature range of transition from solid state to liquid state decreases, and the activation energy of solder phase transformation obtained by non-isothermal differential method and integration method increases gradually. When the content of Sn is 7.2%, the phase transformation activation energy and the pre-exponential factor of Sn-Ag solder are the largest, 555.56kJ / mol and 1.41 × 10 ~ (32), respectively. The expression is: k = 1.41 × 10 ~ (32) exp (-5.56 × 10 ~ 5 / RT). The Sn-containing solder with 7.2% Sn content melts on the surface of 304 stainless steel. The wetting interface microstructure mainly consists of Ag phase, Cu phase, CuZn phase, Cu_5Zn_8 phase, Cu_ (41) Sn_ (11) phase and Ag_3Sn phase.