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本文介绍了主要电力半导体器件的性能、制造技术及应用。全文共分七部分,首先介绍国际动态,接着分别介绍了功率整流二极管、晶闸管、电力晶体管和功率集成电路的种类、参数及应用。最后介绍了当前在工业生产中已被电力半导体器件采用的主要工艺,包括:硅材料、少子寿命、光刻、钝化、腐蚀、金属化及封装技术。在结束语中总结了电力半导体器件的应用范围及今后发展的总趋势。
This article describes the main power semiconductor device performance, manufacturing technology and applications. The full text is divided into seven parts, first introduced the international developments, and then introduced the power rectifier diodes, thyristors, power transistors and power integrated circuit types, parameters and applications. Finally, the main technologies currently used in industrial production for power semiconductor devices are introduced, including: silicon materials, low lifetime, photolithography, passivation, corrosion, metallization and packaging technologies. In conclusion, the application scope of power semiconductor devices and the general trend of development in the future are summarized.