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采用等离子喷涂技术在Cu基体表面制备了Ag/Sn O2涂层,并研究了真空退火对涂层组织和性能的影响。结果表明:在退火过程中,Ag/Sn O2涂层内部银基体再结晶和晶粒长大过程持续进行,Sn O2颗粒在银基体中也进行了重新分布;800℃退火时涂层与基体出现了冶金结合的现象。随着退火温度的提高,Ag/Sn O2涂层硬度显著降低,而涂层电导率的变化趋势与硬度相反。
The Ag / SnO2 coating was prepared on the surface of Cu substrate by plasma spray technique. The effect of vacuum annealing on the microstructure and properties of the coating was also studied. The results show that during the annealing process, the recrystallization and grain growth of the silver matrix in the Ag / SnO 2 coating continue. The SnO 2 particles are also redistributed in the silver matrix. The coating and the matrix appear at 800 ℃ Metallurgical combination of the phenomenon. With the increase of annealing temperature, the hardness of Ag / SnO 2 coating decreased significantly, while the conductivity of coating changed inversely with the hardness.