随着高速测试VLSI器件已成为必不可少,而片上系统时代又日渐临近,IC ATE设计人员正忙于策划新的解决方案。他们不仅着眼于技术的方方面面,也更加注重于测试经济效益。而且,由于样式奇特的器件封装使结点的接触越来越困难,因而电路板ATE公司正在瞄准互补过程改进解决方案,同时保持所需的高故障覆盖率。 With high-speed testing of VLSI devices has become essential, and the era of system-on-chip approaches is approaching again, IC ATE designers are busy planning new solutions. They not only focus on all aspects of technology, but also pay more attention to test the economic benefits. Moreover, ATE, a circuit board company, is aiming for complementary process improvement solutions due to the quirky device package that makes junction contact more and more difficult, while maintaining the high fault coverage required.