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由中国电子材料行业协会电子铜箔材料分会(CCFA)主办的《第五届中国电子铜箔技术·市场研讨会》,将于2014年11月13日~11月15日在苏州华侨饭店召开。本次会议邀请了本行业及上下游多位行业资深专家和领导到会作精彩报告,日本、韩国、台湾同行业厂家代表应邀参加会议。望各会员单位及有意参加本次会议的非会员单位代表踊跃报名参加会议并就行业
The 5th China Electronic Copper Foil Technology Market Seminar, sponsored by China Electronic Materials Industry Association Electronic Copper Foil Materials Branch (CCFA), will be held from November 13 to November 15, 2014 at the Overseas Chinese Hotel in Suzhou. The meeting invited senior experts and leaders from many industries in the industry and upstream and downstream industry to make wonderful reports. Representatives from manufacturers in Japan, South Korea and Taiwan were invited to attend the conference. Member companies and hope to attend this meeting of non-member representatives are encouraged to register for the meeting and on the industry