薄膜制法表1列出了干涉用介质膜可用的生产方法。表1 介质膜制法抛光化学蒸汽淀积劈裂等离子体聚合旋转蒸发浸泡溅射离子镀抛光和劈裂的机械方法很少采用,如只用来制作高级次的干涉滤光片的间隔层。旋转和干燥法用于大面积涂层。化学汽相沉积用于透明导电膜的生产中有利。等离子体聚合和离子镀将来可能是重要的真空制膜法。但蒸发和溅 Film Preparation Table 1 lists the production methods for the dielectric film used for the interference. Table 1 Dielectric Preparation Polishing Chemical Vapor Deposition Splitting Plasma Polymerization Rotary Evaporation Immersion Sputtering Ion plating Polishing and splitting Mechanical methods are seldom used, such as the spacer used to make higher-order interference filters. Rotation and drying method for large area coating. Chemical vapor deposition is advantageous in the production of a transparent conductive film. Plasma polymerization and ion plating in the future may be important vacuum film-forming method. But evaporated and splashed