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K-cor是应用Z-pin增强技术的一种新型高性能结构。本文以NHZP-1树脂为基体研究适合K-cor结构的半固化Z-pin拉挤工艺,得到固化度为51.25%的Z-pin为满足制备要求的最佳参数,并制作悬空装置采用两步法进行半固化Z-pin的植入和压弯,探索出压弯和后固化工艺。在此基础上,对试制的K-cor夹层结构进行平拉和剪切试验研究。结果发现,折弯长度是K-cor夹层结构的另一重要参数,较长的折弯长度会增加Z-pin与蒙皮的结合面积从而提高结构的拉伸性能。
K-cor is a new high-performance architecture that uses Z-pin enhancement technology. In this paper, the Z-pin pultrusion technology suitable for K-cor structure was studied based on NHZP-1 resin. The Z-pin with the curing degree of 51.25% was the best parameter to meet the preparation requirements and the suspension device was fabricated in two steps Method for semi-cured Z-pin implantation and bending, to explore the bending and post-curing process. On this basis, the experiment of flattening and shearing of the prototype K-cor sandwich structure was carried out. The results show that bending length is another important parameter of K-cor sandwich structure. Longer bending length will increase the bonding area between Z-pin and skin to improve the tensile properties of the structure.