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介绍了新型热沉用复合金属材料的设计、制造、应用技术及发展前景。它的出现为解决电子元器件的封装热匹配问题提供了一条有效途径。
The design, manufacture, application technology and development prospect of new heat sink composite metal are introduced. Its appearance provides an effective way to solve the thermal matching problem of package of electronic components.