论文部分内容阅读
介绍一种红外焦平面器件用制冷杜瓦组件 ,该组件用于封装 2 5 6× 2 5 6 Hg Cd Te红外焦平面芯片 ,由直线马达驱动型斯特林制冷机冷却 ,制冷机与杜瓦的耦合采用 IDCA方式 ;制冷机、杜瓦进行一体化优化设计 ,使得整个红外探测器组件能耗、重量大大降低 ,实现了红外探测器组件的小型化。
A kind of refrigeration Dewar assembly for infrared focal plane device is introduced. The module is used to encapsulate 256 × 256 Hg Cd Te infrared focal plane chip, which is cooled by a linear motor-driven Stirling refrigerator. The refrigerator and Dewar Of the coupling using IDCA way; refrigerator, Dewar to optimize the design integration, making the entire infrared detector assembly energy consumption, greatly reducing the weight of the infrared detector components to achieve miniaturization.