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用于集成电路引线框架的Fe-42％Ni合金带不仅要求其物理、机械性能达到一定指标,还要求板形好,使之能适应冲压、腐刻、电镀、钎焊、封装等工序的考验。根据上述要求,在对Fe-42％Ni合金带的成品退火工艺进行了研究、探讨,并利用X射线衍射等实验手段及金属学理论进行分析后得出,温度低于该合金再结晶温度并控制保温时间的张力退火,能使Fe-42％Ni合金带的各项性能得到大幅度改善,满足集成电路引线框架的使用要求。
The Fe-42% Ni alloy tape used for the lead frame of the integrated circuit not only requires its physical and mechanical properties to reach a certain index, but also requires the good shape of the sheet so as to be able to adapt to the test of stamping, decoring, electroplating, soldering and packaging processes . According to the above requirements, the finished annealing process of Fe-42% Ni alloy strip was studied and discussed, and the experimental results of X-ray diffraction and metallogenetic analysis showed that the temperature was lower than the recrystallization temperature Controlling the tension annealing of the holding time can greatly improve the performances of the Fe-42% Ni alloy ribbon and meet the usage requirements of the lead frame of the integrated circuit.