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采用H800透射电镜观察了不同变形量条件下Cu-Zn-Se-Bi-Sn合金的热变形组织。研究发现,在不同变形量的Cu-Zn-Se-Bi-Sn合金中分别出现了位错网、位错墙及位错胞三种位错组态。当变形量为2%时,在Cu-Zn-Se-Bi-Sn合金晶粒内部某些区域形成明显的位错网;变形量达到20%时,位错开始在原始晶界附近规整化排列,并在一些区域内排列成整齐的位错墙,同时出现亚晶界的离解与亚晶间聚合;当变形量达到80%时,出现了明显的动态再结晶亚晶聚合形核。
The microstructure of Cu-Zn-Se-Bi-Sn alloy under different deformations was observed by H800 transmission electron microscope. It is found that three dislocation configurations of dislocation network, dislocation wall and dislocation cell appear in Cu-Zn-Se-Bi-Sn alloy with different deformations. When the amount of deformation is 2%, a significant dislocation network is formed in some regions inside the grain of Cu-Zn-Se-Bi-Sn alloy. When the amount of deformation reaches 20%, the dislocation starts to be regularly arranged near the original grain boundaries , And in some areas arranged in a neat dislocation wall, at the same time there subgrain dissociation and intergranular polymerization; when the amount of deformation reached 80%, there was a clear dynamic recrystallization sub crystalline nucleation.