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以环氧树脂E51作为基体树脂,甲基纳迪克酸酐作为固化剂,端羧基丁腈橡胶作为增韧剂,以2,4,6-三(二甲基氨基甲基)苯酚(DMP-30)和过氧化苯甲酰(BPO)作为促进剂,以机械搅拌共混的方法制备环氧电子封装材料.考察了BPO与DMP-30的用量对固化工艺及固化后树脂的电学性能的影响,得到最优组合.使用高压西林电桥、高阻计测试环氧电子灌封料的介电损耗和体积电阻率,结果表明:BPO为0.6g与DMP-30为0.3g协同促进固化的体系电学性能最优.“,”In this paper,epoxy electronic packaging materials were prepared with epoxy resin E51 as matrix resin,methyl- dick anhydride as curing agent,the carboxylic butyl rubber as toughening agents,and DMP-30 and BPO as promoting agents promote via mechanical agitation blend.The effect of DMP-30 and BPO on the electric properties of epoxy electronic packaging was discussed,then the dosage of the optimal combination was gotten.In addition, the dielectric loss and volume resistivity of the epoxy electronic potting were measured via high voltage and high resistance test plan of the bridge.The experimental results showed that curing system contained 0.6 g BPO and 0.3 g DMP-30 has the electrical optimal performance.