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为了改善SnAgCu系无铅钎料焊点的抗跌落性能,采用实验方法研究了SnAgCu钎料中银含量对焊点抗跌落性能的影响,并对实验结果进行了统计分析。结果表明,随着银含量的降低,在显著度为99%的条件下,钎焊接头的抗跌落性能显著提高。钎焊接头中存在缺口时,跌落次数明显下降。接头的破坏主要发生在钎料与铜基体之间的界面层上,破坏断口具有脆性断裂特征;界面层随着银含量的减小而逐渐减薄,这是导致钎焊接头抗跌落性能提高的主要原因。
In order to improve the anti-drop performance of solder joints of SnAgCu lead-free solder, the influence of silver content in SnAgCu solder on the anti-drop performance of solder joints was studied experimentally and the experimental results were statistically analyzed. The results show that with the decrease of silver content, the anti-dropping performance of brazed joints increases significantly with the significant degree of 99%. There is a significant drop in the number of drops when there is a gap in the brazed joint. The failure of the joint mainly occurs on the interface layer between the solder and the copper matrix, and the fracture of the fracture has brittle fracture characteristics. The interface layer decreases gradually with the decrease of the silver content, which leads to the improvement of the anti-drop performance of the brazed joint main reason.