德州仪器 (TI)与西门子公司已经合作为 GPRS等标准推出新一代移动电话技术 ,最近为 GSM基站开发出一款数字基带芯片设计。该基站设计包括 DSP硅结构、SRAM和 IP,可升级并支持高速的 EDGE标准的数据传输性能 ,该类标准将成为美国市场通行的新一代移动通信标准。该基带芯片结合了 Texas Instruments and Siemens AG have partnered to launch a new generation of mobile phone technology for standards such as GPRS and recently developed a digital baseband chip design for GSM base stations. The base station design, including DSP silicon, SRAM and IP, is scalable and supports high-speed EDGE standards for data transfer performance, a standard of which will be the next generation of mobile communications standard in the United States. The baseband chip is combined