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本文介绍了一种用于研究材料（尤其是薄膜）塑性和弹性性能的超显微压痕系统。薄膜的硬度和杨氏模量由测试过程中记录下来的所谓加载－卸载曲线推导计算而出。这种系统不仅可以精确探测到极小载荷（～０．１ｍＮ）引起的形变（～１ｎｍ），而且能区分由塑性引起的形变和由弹性引起的形变，从而使得获得的硬度值更准确。另外这种系统在一次加载－卸载过程中即可得到薄膜硬度随深度之分布。本工作采用超显微压痕系统研究了ＴｉＮ，ＴｉＢ＿２，ＤＬＣ以及ＣＮ等硬质薄膜的弹性和塑性行为。最后，本文给出了一个该测量系统在薄膜工程中应用的例子。
This article describes an ultramicroscopic indentation system used to study the plastic and elastic properties of materials, especially films. The hardness and Young’s modulus of the film are calculated from the so-called loading-unloading curves derived from the testing. This system not only accurately detects deformations due to very small loads (~ 0.1mN) (~ 1nm), but also differentiates between plastic-induced and elastic-induced deformations, resulting in more accurate hardness values. In addition, this system can obtain the distribution of film hardness with the depth during a loading-unloading process. In this work, the elastic and plastic behavior of TiN, TiB_2, DLC and CN hard films were investigated by using an in-micro indentation system. Finally, this article gives an example of the application of the measurement system in thin film engineering.