Effect of bonding parameters on microstructure and properties of Si_3N_4/Si_3N_4 joint brazed by Cu-

来源 :Transactions of Nonferrous Metals Society of China | 被引量 : 0次 | 上传用户:hxyxy303
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Si_3N_4 ceramic was jointed to Si_3N_4 ceramic using a filler alloy of Cu-Zn-Ti at ~1123-1323K for ~0.3-2.7ks. Ti content in the Cu-Zn-Ti filler alloy was 15%(molar fraction). The effect of bonding parameters ~on the microstructure and mechanical properties of the Si_3N_4/Si_3N_4 joint were investigated. The results indicate ~that with increasing brazing temperature from 1123K to 1323K and brazing time from 0.3ks to 2.7ks, the thickness of the interfacial reaction layer between the filler alloy and the Si_3N_4 ceramic and the size and amount of the reactant products in the filler alloy increase, leading to an increase in shear strength of the joint from ~163MPa to ~276MPa. It is also found that the fracture behavior of the Si_3N_4/Si_3N_4 joint greatly depends on the microstructure of the joint. Si_3N_4 ceramic was joined to Si_3N_4 ceramic using a filler alloy of Cu-Zn-Ti at ~ 1123-1323K for ~ 0.3-2.7ks. Ti content in the Cu-Zn-Ti filler alloy was 15% The effect of bonding parameters ~ on the microstructure and mechanical properties of the Si_3N_4 / Si_3N_4 joint were investigated. The results indicate ~ with increasing brazing temperature from 1123K to 1323K and brazing time from 0.3 Thicknessks to 2.7ks, the thickness of the interfacial reaction layer between the filler alloy and the Si_3N_4 ceramic and the size and amount of the reactant products in the filler alloy increase, leading to an increase in shear strength of the joint from ~ 163 IsMPa to ~ 276MPa. It is also found that the fracture behavior of the Si_3N_4 / Si_3N_4 joint greatly depends on the microstructure of the joint.
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