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采用铸造、热轧、固溶、冷轧和时效的方法制备了Cu-3.5Ni-0.75Si-0.15Co合金,研究了合金硬度、电导率在制备过程中的变化及相应的组织演变规律。结果表明:铸态合金晶粒粗大,热轧过程中发生完全动态再结晶,固溶过程中Ni3Si2相充分溶解,冷轧造成了晶粒拉长和滑移带的出现,时效过程中主要沉淀相为Ni2Si相,有明显的层状结构;合金的硬度和电导率在固溶过程中明显下降,电导率在时效过程中逐渐上升,时效温度越高,合金电导率越高,在时效过程中硬度先快速升高后缓慢下降,温度越高,硬度下降速度越快;合金的抗拉强度在500℃时效2.5 h可以达到814 MPa,对应的电导率为26.1 MS/m。
The Cu-3.5Ni-0.75Si-0.15Co alloy was prepared by the methods of casting, hot rolling, solution treatment, cold rolling and aging. The variation of hardness and conductivity of the alloy during the preparation and the corresponding microstructure evolution were studied. The results show that the as-cast alloy has coarse grains and complete dynamic recrystallization during the hot rolling. The Ni3Si2 phase dissolves fully in the solution and the grain growth and slip band appear during cold rolling. During the aging process, the main precipitates The Ni2Si phase has obvious lamellar structure. The hardness and conductivity of the alloy decrease obviously in the solution process, and the conductivity gradually increases during the aging process. The higher the aging temperature is, the higher the conductivity of the alloy is. The hardness After the first rapid increase and then slow down, the higher the temperature, the faster the hardness decline; tensile strength of the alloy at 500 ℃ aging 2.5h can reach 814 MPa, the corresponding conductivity of 26.1 MS / m.