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据台湾媒体Digitimes报道,近日台积电在一次内部会议上公开了一份工艺的线路图。台积电10nm制程工艺的芯片将在今年年底投入量产,而7nm制程工艺芯片最早会在明年4月进行试产。对于台积电来说,7nm制程工艺的生产时间要比其他竞争对手早很多,据说英特尔的第一款7nm芯片要等到2022年。据知情人士透露,10nm工艺的芯片面积将比目前的16FF+减小50%,但性能提升50%,耗电减少40%。而7nm制程工艺芯片的晶体管密度将提升163%.有业内人士预计在1V电压下,CPU的时钟频率就能冲到3.8GHz,同时温度上限提升至150度。
According to Taiwan media Digitimes reported that TSMC recently in an internal meeting open a circuit diagram of the process. TSMC 10nm process technology chip will be put into mass production by the end of this year, while the first 7nm process technology chip trial production in April next year. For TSMC, 7nm process technology production time much earlier than other competitors, it is said that Intel’s first 7nm chip to wait until 2022. According to informed sources, 10nm process chip area than the current 16FF + reduced by 50%, but performance increased by 50%, power consumption decreased by 40%. The transistor density of 7nm process technology chip will increase 163% .Industry who is expected at 1V voltage, CPU clock frequency will be able to rushed to 3.8GHz, while the temperature limit increased to 150 degrees.