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采用了将超声波辅助化学镀铜工艺与传统化学镀铜工艺对比的方法，研究了超声波辅助处理在陶瓷基片化学镀铜（包括前处理）中的作用，结果表明：超声波辅助处理影响化学镀铜的全过程，具体体现为：超声波辅助除油及粗化处理有利于形成致密、表面平整度高的铜层，超声波辅助敏化和活化处理使铜层表面的平整度下降，超声波辅助处理对化学镀中铜的均匀沉积不利。同时分析了超声波辅助处理对沉积速率及铜层显微硬度的影响。
The ultrasonic assisted electroless copper plating process was compared with the traditional electroless copper plating process. The effect of ultrasonic assisted processing on the electroless copper plating (including pre-treatment) of the ceramic substrate was studied. The results show that ultrasonic assisted processing affects the electroless copper plating Of the whole process, embodied as: ultrasonic assisted degreasing and roughening treatment is conducive to the formation of dense, high surface roughness of the copper layer, ultrasonic assisted sensitization and activation of the copper layer surface roughness decreased, ultrasonic assisted treatment of chemical Uniform deposition of copper in the negative. At the same time, the influence of ultrasonic wave on the deposition rate and the microhardness of copper layer was also analyzed.