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通过在金刚石/铜复合材料表面上化学镀镍的方法使表面金属化以改善其焊接性.研究了镀镍工艺对Ni-P合金镀层中磷含量的影响,以及不同磷含量对镀层的结合强度、耐蚀性和AgCu28钎料铺展性的影响,并对镀层的工艺与厚度进行了优化.AgCu28钎料在磷质量分数为5.8%～8.7%的镀层上均表现出较好的铺展性,且含磷8.7%的镀层比磷含量低的镀层的耐蚀性要好.综合考虑镀层与基体的结合强度和钎料在镀层上的铺展性,认为镀覆时间为10～20 min的镀层,即厚度为5～8μm时,镀层性能最理想.
The surface was metallized to improve its solderability by electroless nickel plating on the surface of diamond / copper composites.The effect of nickel plating process on the content of phosphorus in Ni-P alloy coating and the bonding strength of different phosphorus content on the coating , Corrosion resistance and spreadability of AgCu28 solder, and the process and thickness of the coating were optimized.AgCu28 solder showed good spreading on the coating with phosphorus content of 5.8% ~ 8.7%, and The corrosion resistance of the coating containing 8.7% phosphorus is lower than that of the phosphorus content. Considering the bonding strength between the coating and the substrate and the spreadability of the solder on the coating, it is considered that the coating having the plating time of 10 to 20 minutes, namely the thickness For the 5 ~ 8μm, the coating performance is the best.