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美国空军电子封装及MCM技术规划概要美国空军(USAF)多芯片组件(MCM)先进封装技术研究及其支持活动主要集中在USAF试验室中的PL(Phillips)、RL(Rome)、WL(Wright)试验室和空军技术研究所(AirFomeInsti-tu...
Summary of US Air Force Electronic Packaging and MCM Technology Programs The USAF Multi-Chip Module (MCM) advanced packaging technology research and support activities are mainly focused on PL (Phillips), RL (Rome), WL (Wright) Laboratory and Air Force Institute of Technology (AirFomeInsti ...