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随着PC工业的发展,预计到2007年将急需能够在0.95V时供应200A电流的DC/DC电源变换器。为了能如期实现这种需求,从现在开始就必须对现有的各种技术方案进行审核并提出新的设计思路。文中仔细研究了各类损耗机理,尤其是在每相电流达到30～40A大电流条件下的主要损耗情况。结果表明,该目标是能够实现的。基于这种想法,研制了一种分布式电压调节模块(VRM)。该模块由几路单相供电可达40A,且效率超过80%的子模块构成。采取集成5个子模块的设计方式就能实现200A的总供应电流。多相DC/DC变换器的研究工作包含以下几项:①PWM控制器及其相关组件;②功率MOSEFET、MOSFET驱动器、输出电感及相关组件;③输入/输出电容器组。包括陶瓷电容和电解电容两种类型。文中就第②项设计中存在的问题展开讨论(如功率的处理),这是因为第①,③项已有成熟的标准,并且可以在相关技术文献中找到。在第②项设计中,调节模块每一相的全部元件是集中在一块1.15英寸×0.85英寸的小插板上的,它能供应40A电流,同时还负责接收来自控制器的脉宽调制的TTL电平信号。这个小插板只需占用0.85英寸×0.25英寸的主板空间。它可以放在主板上的任何地方,尤其是贴近CPU的地方,这样便可以减小导通阻抗和损耗,也可使主板的设计者灵活安排功率模块和充分利用PCB空间。另外,每个模块还可以装备单独的散热片。
With the development of the PC industry, it is estimated that by 2007, a DC / DC power converter capable of supplying 200A at 0.95V is urgently needed. In order to be able to fulfill this demand on schedule, from now on, all kinds of existing technical solutions must be reviewed and new design ideas put forward. The paper carefully studied the various types of loss mechanism, especially in the current per phase reached 30 ~ 40A under the conditions of large current loss. The results show that this goal can be achieved. Based on this idea, a distributed voltage regulation module (VRM) was developed. The module consists of several sub-modules with single-phase power up to 40A and efficiency over 80%. Adopt and integrate the design of 5 sub-modules can realize the total supply current of 200A. The research work of the multiphase DC / DC converter includes the following items: ① PWM controller and its related components; ② Power MOS FET, MOSFET driver, output inductor and related components; ③ Input / output capacitor bank. Including ceramic capacitors and electrolytic capacitors of two types. The article on the design of the first ② problems in the discussion (such as power processing), because ①, ③ have mature standards, and can be found in the relevant technical literature. In design (2), all components of each phase of the conditioning module are centered on a 1.15 “x 0.85” header that supplies 40 amps and is also responsible for receiving the pulse width modulated TTL from the controller Level signal. The mini-board takes only 0.85 inches by 0.25 inches of board space. It can be placed anywhere on the motherboard, especially close to the CPU, which can reduce on-resistance and loss, and allow board designers to flexibly configure power modules and maximize PCB space. In addition, each module can be equipped with a separate heat sink.