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建立了复合焊点形态的能量控制方程，采用 Ｓｕｒｆａｃｅ Ｅｖｏｌｖｅｒ软件模拟了复合 ＳｎＰｂ焊点（高 Ｐｂ焊料凸点，共晶 ＳｎＰｂ焊料圆角）的形态利用复合 ＳｎＰｂ焊点形态的计算结果，采用统一型粘塑性 Ａｎａｎｄ本构方程描述复合焊点 Ｐｂ９０Ｓｎ１０和 Ｓｎ６０Ｐｂ４０的粘塑性力学行为，采用非线性有限元方法分析复合 ＳｎＰｂ焊点在热循环条件下的应力应变过程。基于 Ｃｏｆｆｉｎ—Ｍａｎｓｏｎ经验方程预测焊点的热循环寿命，考察焊点形态对焊点可靠性的影响，研究了复合 ＳｎＰｂ焊点间隙和焊点的热循环寿命之间的关系
The energy control equations of composite solder joints were established. The surface morphology of composite SnPb solder joints (high Pb solder bumps and eutectic SnPb solder fillets) were simulated by Surface Evolver software. Viscosity-plasticity Anand constitutive equation describes the viscoplastic behavior of composite joints Pb90Sn10 and Sn60Pb40. The nonlinear finite element method is used to analyze the stress-strain process of composite SnPb joints under thermal cycling. Based on the Coffin-Manson empirical equation, the thermal cycle life of the solder joint is predicted, and the influence of the solder joint morphology on the solder joint reliability is investigated. The relationship between the composite SnPb solder joint gap and the thermal cycle life of the solder joint