前言 负性橡胶系负性抗蚀剂、由远紫外线曝光而复印图形,并采用化学试剂进行腐蚀的传统工艺技术已逐渐适应集成电路集成度迅速提高的需要。 也就是说, (1)由于该抗蚀剂在显影过程中图形胀大,所以必然造成分辨率达到极限。 (2)由湿法腐蚀而不可避免地造成侧向腐蚀,每单位面积内所容纳的元件数就会受到限制。所以,不断地研制新型抗蚀剂、研究新工艺、以求克服上述的限制。 Preface Negative rubber-based negative resist, the traditional process technology that exposes and prints by far ultraviolet ray and uses chemical reagent to corrode has been gradually adapted to the need of rapidly increasing integrated level of integrated circuit. That is to say, (1) due to the pattern development of the resist during development, the resolution must reach the limit. (2) Side corrosion is inevitably caused by wet etching, and the number of components accommodated per unit area is limited. Therefore, the continuous development of new type of resist, new technology research, in order to overcome the above limitations.