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红外焦平面器件广泛应用于国防安全、空间探测、环境监测、工业控制等各个领域,但是由于量少价高的特点,可靠性成为其技术发展的主要瓶颈之一。盲元是红外焦平面的失效像元,是对器件工作特性的反映,因此,可以用作可靠性评价和失效分析手段的重要参数。以出厂时间为界,将盲元分为初始盲元和使用盲元,并分析了其类型、性质、数量、位置及分布等方面的特征。根据红外焦平面器件结构特点,从探测器、互联铟柱和读出电路三个方面分析了盲元形成原因,全面探讨了盲元分析在研究器件损伤应力、失效位置、损伤机理上的应用,以及准确评价器件性能和提高盲元剔除精度的可行性,为器件结构的优化和工艺的改进提供了支撑。
Infrared focal plane devices are widely used in various fields such as national defense security, space exploration, environmental monitoring, industrial control, etc. However, reliability has become one of the major bottlenecks in its technological development due to its characteristics of low price and high price. Blind element is a failed pixel in the infrared focal plane and is a reflection of the operating characteristics of the device. Therefore, it can be used as an important parameter for reliability evaluation and failure analysis. Blind elements are divided into initial blind elements and blind elements using the factory time as the boundary, and the characteristics of their types, properties, quantities, positions and distributions are analyzed. According to the structural characteristics of infrared focal plane device, the causes of blind pixels are analyzed from three aspects: detector, interconnected indium column and readout circuit. The application of blind element analysis in the study of device damage stress, failure location and damage mechanism is discussed comprehensively. As well as the feasibility of accurately evaluating the performance of the device and improving the accuracy of blind rejecting, which provides the support for the optimization of the device structure and the improvement of the process.