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研究表明:EAF-CSP工艺热轧薄板中Cu的偏聚是产生表面微裂纹及边裂的主要原因,控制钢中铜和低熔点元素的总量,调整薄板坯均热温度和时间,可以减少表面微裂纹与边裂;透射电镜观察到纳米尺寸的硫化铜沉淀。讨论了Cu对CSP工艺热轧薄板质量的影响。
The results show that the segregation of Cu in the hot-rolled thin sheet of EAF-CSP is the main reason for surface microcracks and edge cracks. The total amount of copper and low melting point elements in the steel can be controlled and the soaking temperature and time of the thin slab can be reduced Surface microcracks and edge cracks; nanosized copper sulfide precipitation was observed by transmission electron microscopy. The effect of Cu on the quality of CSP hot-rolled sheet was discussed.