利用有限元方法建立轴对称模型分析了SiC颗粒尺寸、体积分数以及温度对铜基复合材料热残余应力的影响。结果表明,随温度的升高,残余应力很快增大;随SiC颗粒尺寸和体积分数的增大,残余应力均呈增大趋势。基体受残余拉应力,颗粒受残余压应力,在结合界面处存在最大残余拉应力。 The finite element method was used to establish the axisymmetric model to analyze the effects of SiC particle size, volume fraction and temperature on the thermal residual stress of Cu-based composites. The results show that with the increase of temperature, the residual stress increases rapidly. With the increase of SiC particle size and volume fraction, the residual stress increases. The matrix is ​​subject to residual tensile stress, the particles are subject to residual compressive stress, and the maximum residual tensile stress exists at the bonding interface.