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信息时代随着科技的飞速发展,电子元器件越来越受到人们的关注,其散热问题导致的寿命缩短和精度降低等缺陷一直是限制产品性能提升的瓶颈。导热绝缘聚合物基复合材料在一定程度上解决了散热这一难题,而优化这类复合材料的性能已成为当今研究的热点。本文从聚合物基导热绝缘复合材料的导热机理出发,分析了部分导热模型的优缺点;重点讨论了金属填料、陶瓷填料和碳系填料对填充型导热绝缘聚合物基复合材料性能的影响规律,并对该领域今后的研究提出几点建议。
With the rapid development of science and technology in the information age, electronic components have attracted more and more attention. The defects such as shortened life span and reduced accuracy due to heat dissipation have always been the bottlenecks that limit product performance. Heat-conducting insulating polymer matrix composites solves the problem of heat dissipation to a certain extent, and the optimization of the properties of these composites has become a hot spot in today’s research. In this paper, based on the thermal conduction mechanism of polymer-based thermally conductive composites, the advantages and disadvantages of some thermal models are analyzed. The influence of metal fillers, ceramic fillers and carbon fillers on the performance of filled thermally conductive polymer-based composites is discussed. And make some suggestions on the future research in this field.