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晶圆龙头台积电先进制程技术再次向前大步跃进,看好快充电源管理IC市场潜力,协同合作伙伴戴乐格半导体(Dialog Semiconductor),将于明年第1季推出首颗氮化镓(GaN)手机快充晶片,挑战快充晶片龙头德仪(TI)及恩智浦(NXP)霸主地位。喧腾已久氮化镓制程,台积电终于宣布跨入氮化镓先进制程,为合作客户德商戴乐格量身打造,采用6英寸、0.5微米、650V硅上氮化镓(GaN-On-Silicon)制程技术,生产首颗氮化镓手机快充晶片,预计在明年第1季产出,该晶片
Wafer leader TSMC advanced process technology once again leaps and bounds, optimistic about fast charging power management IC market potential, collaborative partner Dell Lattice Semiconductor (Dialog Semiconductor), will be the first quarter of next year launched the first gallium nitride (GaN) Mobile phone fast charge chip, challenge fast charge chip leader TI (TI) and NXP dominance. With its long history of gallium nitride manufacturing, TSMC has finally announced its stride into the advanced process of gallium nitride. It is tailor-made for the cooperative customers of Germany, Germany and Lele and adopts GaN-On-Silicon (GaN-On-Silicon) ) Process technology, the production of the first gallium nitride mobile phone fast charge chip is expected to be produced in the first quarter of next year, the chip