最近，美国罗彻斯特大学与马萨诸塞州斯特布里金·诺瓦高科技公司合作，开发成功一套集成电路芯片制造系统。该系统的核心是一个X射线准直透镜，它能使芯片的集成度成倍提高。这个研究组的目标是使集成电路制造工艺达到0．1μm线宽。理论上，X射线能达到的线宽比现在最细的0．1 Recently, the University of Rochester and Strobel, Massachusetts, Nova high-tech companies to develop a successful integrated circuit chip manufacturing system. At the heart of the system is an X-ray collimating lens that doubles the chip’s integration. The goal of this research group is to make the integrated circuit manufacturing process reach 0.1μm line width. In theory, the line width that X-rays can reach is 0.1, the thinnest