塑封器件在高可靠性领域应用越来越广泛,为了降低使用风险,很有必要进行相应的检测或筛选,扫描声学显微镜检查就是其中一种很重要的无损检测手段。但是,在进行声扫时,对于某些最新的封装方式,需要特殊情况特殊分析,以避免因为器件的封装形式而非器件的缺陷拒收产品。在电子封装设计时,芯片表面可能涂覆一层有机材料来保护集成电路。但这种材料声扫结果往往与真正的分层一样显示为负波,容易误判为不合格。就这种结构及其声扫结果提出了几种验证方法。 Plastic encapsulation devices are widely used in the field of high reliability. In order to reduce the use risk, it is necessary to carry out the corresponding detection or screening. Scanning acoustic microscopy is one of the most important nondestructive testing methods. However, special special case analysis is required for some of the newest packages when performing sound sweep, to avoid rejecting the product because of the device’s package rather than device defects. In the electronic package design, the chip surface may be coated with a layer of organic material to protect the integrated circuit. However, the sound scavenging results of such materials are often displayed as negative waves as real stratification, which is easily misjudged as unqualified. Several verification methods have been proposed for this structure and its sounding results.