使用COMSOL Multiphysics模拟计算软件,建立了水平管道凝固模型,采用自适应网格划分法划分网格,在温度场和流场耦合作用下,对熔融硅在水平管道中的凝固过程进行数值模拟。模拟结果显示:在熔融硅的凝固过程中,在靠近坩埚口壁面附近出现了流线形状的波纹,并形成了漩涡流。在凝固区和结晶区熔融硅释放了大量的潜热,其外边界热流密度较大。该研究为获得超薄硅片成形所需的稳定生长环境和制备更为平整的薄片提供理论依据。 Using COMSOL Multiphysics simulation software, a horizontal pipe solidification model was established. The mesh was divided by adaptive meshing method. The solidification process of molten silicon in horizontal pipe was simulated under the coupling of temperature field and flow field. The simulation results show that in the process of solidification of molten silicon, the streamline shape ripples appear near the wall of the crucible and a vortex flow is formed. In the solidification zone and the crystalline zone, molten silicon releases a large amount of latent heat and its outer boundary heat flux is higher. The research provides a theoretical basis for obtaining the stable growth environment required for ultra-thin silicon wafer formation and preparing a flatter wafer.