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采用动态热机械分析法详细考察了中温(125℃)固化氰酸酯树脂基体的温度-模量谱,研究了连续温度变化情况下促进剂用量、固化温度、环氧树脂、多官能氰酸酯对树脂基体的模量、损耗、玻璃化转变温度等使用性能的影响。促进剂的加入有效地提高了CE树脂中温固化反应程度和固化物的Tg,加入量在1.5phr时,改性CE树脂的弹性模量在150℃处显现出GPa量级波动,但仍呈玻璃态特征,表观Tg达238℃。提高固化温度,可使DMA曲线上的弹性模量波动消失,180℃固化后的Tg与中温固化的表观Tg相近。采用E-51环氧改性CE树脂,会显著降低树脂的耐热性。E-51用量在10份,Tg在233.5℃,用量到20份以上时,CE树脂的Tg急剧降低。酚醛型氰酸酯CY-5能有效地提高树脂的Tg,用量在20份时,Tg可达289℃。
The thermo-mechanical analysis method was used to investigate the temperature-modulus spectrum of the cyanate resin matrix cured at 125 ℃. The effects of the amount of accelerator, curing temperature, epoxy resin, polyfunctional cyanate ester On the resin matrix modulus, loss, the use of glass transition temperature and other properties. The addition of accelerant increased the degree of temperature curing reaction and the Tg of the cured product effectively. When the addition amount was 1.5phr, the elastic modulus of the modified CE resin showed GPa fluctuation at 150 ℃, The morphological characteristics, apparent Tg of 238 ℃. When the curing temperature is increased, the elastic modulus on the DMA curve disappears. The Tg after curing at 180 ℃ is similar to the apparent Tg at medium temperature. The use of E-51 epoxy modified CE resin, will significantly reduce the resin heat resistance. When the amount of E-51 is 10 parts and the Tg is 233.5 ° C, the Tg of the CE resin sharply decreases when the amount is more than 20 parts. Phenolic cyanate ester CY-5 can effectively increase the Tg of the resin, with a Tg of 289 ° C at 20 parts.