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目的：探讨采用 MSCT 影像三维多模态重建技术在人工耳蜗植入术术前评估、术后复查中的应用价值。方法①应用双阈值重建技术显示耳蜗、前庭、半规管的膜性立体结构及听小骨，颞骨透明成像，逐一融合显示听小骨、内耳与颞骨的关系；②面神经曲面重建显示面神经的走行，观察面神经与面神经隐窝、外耳道后壁、鼓索神经等邻近结构的关系；③双斜径多平面重建（MPR）技术测量鼓岬平面面神经垂直段与鼓索神经的距离。结果该组83例，内耳畸形11例中 Mondini 畸形2例、半规管畸形2例、共同腔畸形2例、内听道狭窄1例、前庭导水管扩大4例。正常结构耳鼓岬平面面神经垂直段与鼓索神经距离左侧（0．270±0．057）cm，右侧（0．280±0．068）cm。术后复查5例，清晰显示植入电极位置良好。结论多模态重建技术能较好地满足临床多角度、全方位观察中耳和内耳解剖的需要，评估手术风险，确保手术顺利进行并可应用于术后复查植入电极的位置。“,”Objective To investigate the application and value of MSCT multimodal three-dimensional (3D)recon-struction in cochlear implantation.Methods ① The membranous structures with 3D imaging of cochlea,vestibular, semicircular canal and temporal bone transparent imaging were constructed with a double threshold reconstruction tech-nique,where the anatomical relationship between ossicles,inner ear and temporal bone were displayed.② The facial nerve reconstruction displayed the path of the facial nerve.The ultrastructure showed the facial nerve,facial nerve re-cess,posterior wall of the external auditory canal and the structure of chorda tympani nerve and neighboring structures.③ The distance between promontory plane vertical segment of the facial nerve and chorda tympani nerve was measured. Results Of the 83 patients recruited in this study,11 had inner ear malformation.Of them,2 had Mondini malforma-tion,2 had semicircular canal malformation,2 had common cavity malformation,1 had internal auditory canal stenosis, and 4 had enlarged vestibular aqueduct.The distance between normal structure of cape plane vertical segment of the fa-cial nerve and chorda tympani nerve was 0.27 ±0.057 cm at the left-side and 0.28 ±0.068 cm at the right-side.An in-tact structure of the implanted electrodes was clearly showed in 5 patients in the post-operative examination.Conclusion The 3D multimodal reconstruction technique is useful in providing ultrastructure imaging of the middle and inner ear, which is important for surgeons in pre-and post-operative evaluations of the success and potential risk factors for per-forming cochlear implantation.