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ＢＰＳ研制出一种用于ＰＤＰ应用的新型高速ＭｇＯ溅射源。该溅射源与现有的用于大批量生产的立式串级系统完全兼容。工艺过程是基于在金属镁靶上进行的全反应。此装置采用特殊设计，可解决低附着率以及由于靶电弧所引起的工艺不稳定等问题。本文还进一步讨论了表面拓朴学，溅射阻力以及其它有影响的参数。
BPS developed a new high-speed MgO sputtering source for PDP applications. This sputtering source is fully compatible with existing vertical cascade systems for mass production. The process is based on a complete reaction on a metallic magnesium target. The device is specially designed to solve problems such as low adhesion and process instability due to target arc. This article further discusses the surface topology, sputtering resistance and other influential parameters.