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利用X射线衍射法和红外光谱分析法对芳纶Ⅲ的聚集态结构及大分子结构进行测试分析,采用TG/DSC同步热分析仪对其热学性能进行测试研究,并利用扫描电镜观察其加热状态下的形貌变化。结果表明:芳纶Ⅲ的聚集态结构具有非常好的取向度,取向度高于对位芳纶纤维,但其结晶度较低;芳纶Ⅲ的大分子链中存在苯并咪唑环;芳纶Ⅲ的热稳定性很好,其初始分解温度约为465℃,当温度上升到531℃时会产生裂解,当加热至900℃时质量残余量仍有58%;加热过程中,400℃之前纤维外观形貌无明显变化,当温度达到920℃时,纤维产生略微熔融。
The structure and molecular structure of aramid fibers were investigated by X-ray diffraction and infrared spectroscopy. The thermal properties of aramid fibers were tested by TG / DSC simultaneous thermal analyzer. The heating state was observed by scanning electron microscopy Under the morphological changes. The results show that the molecular structure of aramid Ⅲ has a very good degree of orientation and a higher degree of orientation than the para-aramid fiber, but its crystallinity is low. The benzimidazole ring exists in the macromer chain of aramid Ⅲ. The thermal stability of Ⅲ is very good. The initial decomposition temperature is about 465 ℃. When the temperature rises to 531 ℃, it will be cracked. When the temperature is up to 900 ℃, the residual mass is still 58%. During the heating, the fiber before 400 ℃ There was no obvious change in the appearance of the fiber. When the temperature reached 920 ℃, the fiber was slightly melted.