论文部分内容阅读
采用晶体相场法研究了二元合金形变过程中界面Kirkendall空洞的形貌演化和生长过程。研究表明,Kirkendall空洞优先在界面处形核,空洞尺寸随着演化时间和应变速率的增加而增大。在恒定和循环应变速率较大时,空洞发生明显的合并生长。当循环应变速率大于1.0×10~(-6)时,空洞生长指数随应变速率的增加而增大;当循环应变速率小于9.0×10~(-7)时,空洞生长指数随着应变速率的增加呈先增大后减小的变化规律。在相同的循环应变速率不同循环周期长度情况下,空洞生长指数随着循环周期长度的增加呈先增大后减小的变化规律。
The morphology evolution and growth process of interface Kirkendall voids during the deformation of binary alloys were studied by crystal phase field method. The study shows that Kirkendall voids preferentially nucleate at the interface and the void size increases with the increase of evolution time and strain rate. At constant and high cyclic strain rates, voids undergo significant combined growth. When the cyclic strain rate is more than 1.0 × 10 ~ (-6), the void growth index increases with the increase of strain rate. When the cyclic strain rate is less than 9.0 × 10 ~ (-7), the void growth index increases with strain rate Increasing increases first and then decrease the variation. Under the same cyclic strain rate with different cycle lengths, the void growth index increases first and then decreases with the increase of the cycle length.