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本文首先使用磁控溅射法在清洁的金刚石厚膜表面溅射Ti/Cu层,利用热的浓硫酸腐蚀表层的Cu和Ti层,获得具有合金TiC层的金刚石厚膜表面,实现金刚石厚膜的表面金属化;然后利用高频感应加热方法,以Ag-Cu-Ti混合粉末作为焊料进行金刚石厚膜的钎焊实验,主要对钎焊过程中的钎焊温度、保温时间以及焊料用量等参数进行了研究。结果表明,以60℃/s的速度加热到870℃后保温15 s,焊料用量为80μg时,金刚石厚膜与硬质合金刀具之间的焊接强度可以达到125 MPa,可以满足机械加工强度要求。
In this paper, first, the Ti / Cu layer is sputtered on the surface of a clean diamond thick film by magnetron sputtering, and the Cu and Ti layers on the surface are etched by hot concentrated sulfuric acid to obtain a diamond thick film surface with an alloy TiC layer, Of the surface of the metal; and then using high-frequency induction heating method to Ag-Cu-Ti mixed powder as a brazing diamond thick film experiment, the brazing process mainly brazing temperature, holding time and the amount of solder and other parameters Were studied. The results show that the welding strength between diamond thick film and cemented carbide tool can reach 125 MPa when heated to 870 ℃ for 15 s at 60 ℃ / s and the dosage of solder is 80 μg, which can meet the mechanical processing strength requirements.