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据《Semiconductor International》1988年6月号报道,1987年11月份,该刊曾在其读者范围内进行了一次以生产能力、质量和现代化技术为条件,评选当年引入半导体制造工业的最佳设备的活动,并公布了评选结果。当选为1987年度“五佳”半导体设备的名次及其简介如下: 1、LY1型YAG激光切除系统(美国Alessi公司产品)。它将脉冲Nd:YAG激光器直接安装在Bausch&Lomb微变焦镜头上,即可切割大多数通用材料,又能对样品进行分析探测、是产品故障分析的重要手段。
According to “Semiconductor International” reported in June 1988, in November 1987, the magazine carried out within its readership a selection of the best equipment introduced into the semiconductor manufacturing industry that year under the conditions of production capacity, quality and modern technology Activities, and announced the results of the selection. Was elected 1987 “Top Five” semiconductor equipment rankings and their profiles are as follows: 1, LY1-type YAG laser removal system (the United States Alessi products). It directly imposes a pulsed Nd: YAG laser on a Bausch & Lomb micro-zoom lens to cut most common materials and analyze samples. This is an important means of product failure analysis.