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据报道,2017年全球晶圆代工产能进入扩张期。除了台积电与联电分别于南京与厦门扩建12英寸晶圆产能外,大陆也积极针对逻辑IC与存储器进行扩产,带动晶圆制造设备及耗材需求。主要的晶圆制造设备集中于微影、蚀刻、扩散、检测,但全球主要供应厂商都集中在欧美日,预估两岸设备厂整体受惠程度有限,但部分耗材厂、精测研磨光阻液台厂仍有机会。
It is reported that in 2017 the global foundry manufacturing capacity into the expansion period. In addition to TSMC and UMC in Nanjing and Xiamen, respectively, to expand 12-inch wafer production capacity, the mainland is also actively targeting logic IC and memory expansion, driving wafer manufacturing equipment and supplies demand. The main wafer manufacturing equipment focuses on photolithography, etching, diffusion and testing. However, the major suppliers in the world are concentrated in Europe, the United States and Japan. The estimated overall benefits of cross-Strait equipment factories are limited. However, some of the consumables factories, Taiwan plant still have a chance.